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4 TECHNOLOGY From a technological point of view, pastes involve the interplay of several scientific disciplines. Sciences and technologies utilized include metallurgy/particle technology, chemistry/physics, rheology, and formulation technology. 1 illustrates the spirit of paste technology. Based on this technology, a number of existing and/ or potential application product lines can be derived, in addition to solder paste. Compositionally, these product lines consist of organo-polymeric vehicle and metallic/nonmetallic particulates, ranging from PM (powder metallurgy) injection molding and EMI (electromagnetic interference) shielding composite, to cermet thick film, polymer thick film, and brazing paste and adhesive.
Because in-depth discussion is beyond the scope of this book, further reading is recommended. ~ In addition to the strength offlux agent, fluxing kinetics is another important aspect of fluxing performance. Regarding kinetics, temperature and time are two universal variables. Without getting into formulation specifics, the flux activation temperature and activation time during heating/reflow have to be designed to fit the process settings. , to prevent reoxidation during reflow cycle). The molecular structure and physical/chemical properties of the flux system respond to heating.
2. Through the understanding of metallurgy, the solder alloy is selected with the consideration of solderability and joint integrity. Through particle technology, the size distribution, the shape, and the morphology of the alloy powder are considered to formulate the desired paste applicability and solderability. , reactivity with solder powder and surfaces to be joined, and reactivity in relation to temperature) which affect solderability, residue characteristics and joint integrity can be better understood.